Is this the new SUPER PASTE for PCs?!

JayzTwoCents

28 Mar 202416:09

Summary

TLDRThe video explores the effectiveness of Slice Engineering Boron Nitride Thermal Paste, initially used for 3D printers, against Kingpin Extreme in a computer cooling context. Despite its high thermal conductivity rating of 31.8 watts per meter Kelvin, the paste's thin consistency led to suboptimal heat transfer in the test setup. The experiment highlighted the importance of using thermal pastes with appropriate viscosity and phase change properties for optimal heat management in different applications.

Takeaways

🧪 The video discusses the testing of Slice Engineering Boron Nitride thermal paste, used for 3D printers and high-temperature applications.
🔬 The thermal conductivity of materials is measured in watts per meter Kelvin, with the Kingpin Extreme having a rating of 13.8.
🏎️ The Slice Engineering Boron Nitride paste has a high thermal conductivity of 31.8 watts per meter Kelvin, but becomes non-conductive at 100°C.
💧 The paste is water-soluble, making it easy to clean up with rubbing alcohol, which is a useful property for maintenance and repairs.
🔩 The video compares the performance of the new thermal paste with Kingpin Extreme, which is widely used and known for its ease of application.
🌡️ The testing setup includes a locked voltage, frequency, and fan speeds to ensure consistent and fair comparison of the thermal pastes.
📈 The initial spike temperature is important for assessing the effectiveness of thermal paste in filling microscopic voids between the CPU and cooler.
🥪 The video uses the analogy of a cheeseburger layer to describe the different components involved in heat transfer from the CPU to the cooler.
🛠️ The application process of the Boron Nitride paste is found to be quite thin and watery, potentially leading to suboptimal heat transfer.
🧹 Cleaning up the water-based paste is straightforward, but the video suggests that its properties may not be ideal for use between compressed metal surfaces.
📚 The conclusion emphasizes the importance of using the appropriate thermal paste for the specific application to ensure optimal heat transfer and system performance.

Q & A

What is the primary purpose of thermal paste?
-The primary purpose of thermal paste is to fill in microscopic voids and air pockets between the heat source (like a CPU die) and the cooler, thereby improving heat conduction and preventing thermal throttling.
How is thermal paste conductivity measured?
-Thermal paste conductivity is measured in watts per meter Kelvin (W/m·K), which indicates the material's ability to conduct heat relative to temperature change.
What are the key differences between Kingpin Extreme and Slice Engineering Boron Nitride thermal pastes?
-Kingpin Extreme has a watts per meter Kelvin rating of 13.8, making it easy to apply and spread. In contrast, Slice Engineering Boron Nitride thermal paste has a significantly higher rating of 31.8 but becomes non-conductive once heated above 100°C and is water-soluble for easy cleanup.
Why is it important to have a thermal material with the right consistency?
-The right consistency ensures that the thermal material can effectively fill in the microscopic gaps between components without being squeezed out or becoming too thick, which could impede heat transfer.
What is the role of the IHS in a CPU cooler setup?
-The Integrated Heat Spreader (IHS) is the metal part of the CPU that is responsible for transferring heat from the CPU die to the cooler. It is crucial for efficient heat dissipation.
What happens when thermal paste gets too hot?
-When thermal paste gets too hot, such as above 100°C, it can change its properties. For instance, the Boron Nitride paste becomes non-conductive and may also dry up, affecting its heat conduction capability.
How does the thermal paste application process impact its performance?
-The application process is critical as an even and properly spread layer of paste ensures optimal heat transfer. Too much or too little paste, or an uneven spread, can reduce efficiency and lead to higher temperatures.
Why did the Boron Nitride thermal paste not perform as expected in the test?
-The Boron Nitride thermal paste did not perform as expected because it was too watery and thin, causing it to be squeezed out from between the CPU and cooler, leading to suboptimal heat transfer.
What is the significance of the thermal interface material between the IHS and the cooler?
-The thermal interface material between the IHS and the cooler is essential as it aids in transferring heat from the IHS to the cooler. If the material is of poor quality, it can create a bottleneck, leading to increased temperatures and potential thermal throttling.
How can you clean up thermal paste that is water-based?
-Water-based thermal pastes can be cleaned up relatively easily using isopropyl alcohol. They tend to dry up and evaporate, allowing for quick and efficient cleanup.
What is the moral of the story from the video?
-The moral of the story is to use the proper thermal paste for the intended application. Not all thermal pastes are created equal, and using the right one is crucial for optimal heat transfer and system performance.

Outlines

00:00

🔧 Introduction to Thermal Pastes and Conductivity

The video begins with an introduction to thermal pastes, focusing on a specific product - Slice Engineering Boron Nitride Paste. This paste is designed for 3D printers and high-temperature applications such as temperature probes and hotheads. The video aims to compare this paste with Kingpin Extreme, a popular choice for thermal conductivity. The script explains that thermal paste conductivity is measured in watts per meter Kelvin (W/m·K), and provides a brief overview of the Kingpin Extreme's performance with a W/m·K of 13.8. It also mentions the unique properties of the Boron Nitride Paste, which has a high W/m·K rating of 31.8 but becomes non-conductive at 100°C and is water-soluble for easy cleanup.

05:02

🌡️ Testing and Application of Thermal Pastes

The script continues with a detailed explanation of the testing process for thermal pastes. It describes the setup for measuring the initial spike in temperature and the importance of filling microscopic voids between the CPU and cooler with thermal paste to efficiently conduct heat. The video then presents the results of a test using Kingpin Extreme, showing a package temperature spike to 82-84°C and a multicore score of 4,451. Following this, the script discusses the application of the Boron Nitride Paste, noting its water-based nature and ease of application. However, it also highlights issues with the paste's watery consistency, which may lead to it being squeezed out from under the cooler, potentially affecting performance.

10:02

📉 Analyzing Results and Thermal Paste Properties

In this section, the script analyzes the results of the thermal paste test, noting high temperatures and a drop in performance scores. It emphasizes the importance of efficient heat transfer from the CPU to the cooler and the potential bottleneck caused by suboptimal thermal interface material. The script also discusses the properties of the Boron Nitride Paste, suggesting that its watery consistency may not be suitable for CPU cooling due to its tendency to be squeezed out under pressure. It also touches on the phase change the paste undergoes when heated, turning from a liquid to a solid state.

15:03

🚫 Conclusion on the Suitability of Boron Nitride Paste

The video concludes with a discussion on the suitability of the Boron Nitride Paste for computer cooling. Despite its high thermal conductivity rating, the paste's watery consistency and the issues with application lead to poor heat transfer results. The script reiterates the importance of using the correct thermal paste for the intended application and the need for a balance between thermal conductivity and physical consistency. It also reflects on the learning experience, acknowledging the complexity of materials science and the importance of using appropriate materials for specific applications.

Mindmap

Keywords

💡Thermal paste

Thermal paste is a compound used to fill the microscopic gaps between two surfaces, such as a CPU and its cooler, to improve heat transfer. In the video, the focus is on comparing different types of thermal pastes, specifically the Kingpin Extreme and a boron nitride paste by Slice Engineering, for their thermal conductivity properties.

💡Thermal conductivity

Thermal conductivity is a material property that describes its ability to conduct heat. It is measured in watts per meter Kelvin (W/m·K) and indicates how effectively heat can be transferred through the material. In the context of the video, this property is critical for evaluating the performance of different thermal pastes.

💡Boron nitride

Boron nitride is a compound used in the thermal paste discussed in the video. It is known for its high thermal conductivity and is specifically designed for applications like 3D printers where precise temperature control is necessary. However, it has a unique property of becoming non-conductive once heated above 100°C.

💡3D printers

3D printers are manufacturing devices that create three-dimensional objects by successively adding layers of material. They require precise temperature control for the proper functioning of components like hotends and temperature probes, which is where specialized thermal pastes like boron nitride come into play.

💡Heat conduction

Heat conduction is the transfer of thermal energy through a material without movement of the material itself. It is a fundamental process in thermal management, especially in electronics where efficient heat conduction away from heat-generating components is essential to prevent overheating and maintain performance.

💡Temperature probes

Temperature probes are sensors used to measure the temperature of a system or environment. In the context of 3D printers, they are crucial for monitoring the temperature of the print head to ensure that materials like PLA or ABS are extruded at the correct temperatures for proper layer formation.

💡Water-based

Water-based substances are those that primarily consist of water and are known for their ability to be easily cleaned with water or other solvents like isopropyl alcohol. In the context of the video, the boron nitride thermal paste is described as water-based, which affects its application and cleanup process.

💡Thermal throttling

Thermal throttling is a phenomenon where a device, typically a computer or its components, slows down its performance to reduce heat generation when temperatures reach certain thresholds. This is a safety measure to prevent damage due to overheating.

💡CPU

A CPU (Central Processing Unit) is the primary component of a computer that performs most of the processing inside the computer. It is often referred to as the 'brain' of the computer. In the context of the video, the CPU is the heat-generating component that requires efficient cooling to function optimally.

💡Overclocking

Overclocking is the practice of increasing the operating frequency of a component, such as a CPU, beyond the manufacturer's specified limits to achieve higher performance. This often results in increased heat generation and requires effective cooling solutions to manage the additional heat.

💡AIO cooler

An AIO (All-In-One) cooler is a type of liquid cooling system that comes pre-assembled with a water block, radiator, pump, and fans. It is used to dissipate heat from components like CPUs by circulating coolant through the system, thereby providing effective cooling.

Highlights

The discussion focuses on comparing Slice Engineering Boron Nitride Paste with Kingpin Extreme, two thermal pastes with different applications.

Thermal paste conductivity is measured in watts per meter Kelvin, a critical factor when comparing different pastes.

Kingpin Extreme has a watts per meter Kelvin of 13.8, making it a widely used thermal paste for general applications.

Slice Engineering Boron Nitride Paste has an impressively high watts per meter Kelvin of 31.8, indicating superior heat conduction potential.

The Boron Nitride Paste becomes non-conductive once heated up to 100 C, which is a unique characteristic for specific applications.

The experiment includes a controlled environment with a locked voltage, frequency, and fan speeds to ensure accurate thermal paste comparison.

The initial spike temperature is crucial for assessing the thermal paste's effectiveness in filling microscopic voids between the CPU and cooler.

The testing procedure involves a 10-minute test to observe the maximum temperature reached, providing insights into the thermal paste's long-term performance.

The importance of the thermal interface material is emphasized, as it prevents heat bottlenecks and contributes to maintaining optimal CPU performance.

The experiment results show that the Kingpin Extreme paste led to package temperatures in the low to mid-80s, with a peak of 84-85 degrees.

The Boron Nitride Paste's application revealed it to be much thinner than expected, which could affect its performance when compressed between CPU and cooler.

Despite its high conductivity rating, the Boron Nitride Paste underperformed in the test, possibly due to its watery consistency and tendency to be squeezed out.

The cleanup process for the water-based Boron Nitride Paste is easy, using isopropyl alcohol to remove residue.

The conclusion emphasizes the importance of using the appropriate thermal paste for specific applications, as not all pastes are equal.

The video serves as an educational resource, demonstrating the practical application and testing of thermal pastes in real-world scenarios.

The experiment's design and findings highlight the significance of thermal conductivity in maintaining CPU performance and the role of thermal paste.

The video content is a response to a viewer's request, showcasing the practical examination of Slice Engineering Boron Nitride Paste.